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| DSP 25 Phase-leg Rectifier Diode VRSM V 1300 1700 VRRM V 1200 1600 TO-247 AD TO-268 AA ISOPLUS 247 TM VRRM = 1200/1600 V IF(RMS) = 2x43 A IF(AV)M = 2x28 A TO-247 AD Version A TO-268 AA Version AT Type DSP 25-12A DSP 25-16A DSP 25-12AT DSP 25-16AT 1 2 3 DSP 25-16AR 1 2 3 1 2 (TAB) 3 2 (TAB) Symbol IF(RMS) IF(AV)M IFSM Test Conditions TVJ = TVJM Tcase = 100C; 180 sine TVJ = 45C; t = 10 ms t = 8.3 ms (50 Hz), sine (60 Hz), sine (50 Hz), sine (60 Hz), sine (50 Hz), sine (60 Hz), sine (50 Hz), sine (60 Hz), sine Maximum Ratings 43 28 300 330 270 300 450 450 340 325 -40...+180 180 -40...+150 A A A A A A A2s A2s A2s A2s C C C Nm N V~ g ISOPLUS 247 TM Version AR 1 2 3 TAB TVJ = 150C; t = 10 ms t = 8.3 ms I2t TVJ = 45C t = 10 ms t = 8.3 ms 1 = Cathode, 2 = Anode/Cathode, 3 = Anode TVJ = 150C; t = 10 ms t = 8.3 ms TVJ TVJM Tstg Md * FC VISOL ** Weight * Verson A only; ** Version AR only mounting torque M3 mounting force with clip 50/60 Hz, RMS, t = 1 minute, leads-to-tab TO-268 / TO-247 0.8...1.2 20...120 2500 4/6 Features International standard packages JEDEC TO-247 AD and TO-268 AA surface mountable For single and three phase bridge configuration Planar passivated chips Epoxy meets UL 94V-0 flammability classification Version AR isolated and UL registered E153432 TO-247 AD and ISOPLUS 247 TM Symbol IR VF VT0 rT RthJC RthCH a Test Conditions TVJ = 150C VR = VRRM Characteristic Values 2 1.6 0.8 15 1.5 0.4 100 mA V V m K/W K/W m/s2 Dim. Millimeter Min. Max. 19.81 20.32 20.80 21.46 15.75 16.26 3.55 3.65 4.32 5.4 1.65 1.0 10.8 4.7 0.4 1.5 5.49 6.2 2.13 4.5 1.4 11.0 5.3 0.8 2.49 TM IF = 55 A; TVJ = 25C For power-loss calculations only TVJ = TVJM DC current DC current (with heatsink compound) Maximum allowable acceleration Inches Min. Max. 0.780 0.819 0.610 0.140 0.170 0.212 0.065 0.040 0.426 0.185 0.016 0.087 0.800 0.845 0.640 0.144 0.216 0.244 0.084 0.177 0.055 0.433 0.209 0.031 0.102 TO-268 AA Outline Dim. A A1 A2 b b2 C D E E1 e H L L1 L2 L3 L4 Millimeter Min. Max. 4.9 2.7 .02 1.15 1.9 .4 13.80 15.85 13.3 5.1 2.9 .25 1.45 2.1 .65 14.00 16.05 13.6 Inches Min. Max. .193 .106 .001 .045 .75 .016 .543 .624 .524 .201 .114 .010 .057 .83 .026 .551 .632 .535 A B C D* E F G H J K L M N 5.45 BSC 18.70 19.10 2.40 2.70 1.20 1.40 1.00 1.15 0.25 BSC 3.80 4.10 .215 BSC .736 .752 .094 .106 .047 .055 .039 .045 .010 BSC .150 .161 * ISOPLUS 247 without hole 211 Data according to IEC 60747 and refer to a single diode IXYS reserves the right to change limits, test conditions and dimensions (c) 2002 IXYS All rights reserved 1-2 DSP 25 70 A 60 IF 50 40 200 A IFSM 50 Hz, 80% VRRM 103 A2s It 2 VR = 0 V TVJ = 45C TVJ = 45C 100 30 20 10 0 0.0 0 0.001 102 0.01 0.1 t s 1 1 2 3 4 5 6 7 ms 10 89 t TVJ = 150C TVJ = 25C TVJ = 150C TVJ = 150C 0.5 1.0 VF 1.5 V 2.0 Fig. 1 Forward current versus voltage drop per diode 60 W 50 Ptot 40 Fig. 2 Surge overload current Fig. 3 I2t versus time per diode 30 RthJA: 0.5 1.8 3 5 8 15 KW KW KW KW KW KW A Id(AV)M 20 30 20 10 10 0 0 5 10 15 20 Id(AV)M 25 A 0 40 80 120 Tamb 0 160 C 0 30 60 90 120 150 180 C TC Fig. 4 Power dissipation versus direct output current and ambient temperature, sine 180 1.6 K/W 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0.0001 DSP25 Fig. 5 Max. forward current versus case temperature Constants for ZthJC calculation: i 1 2 3 4 5 Rthi (K/W) 0.06075 0.183 0.3405 0.543 0.3728 ti (s) 0.0004 0.00256 0.0045 0.0242 0.15 0.001 0.01 0.1 1 t s 10 Fig. 6 Transient thermal impedance junction to case (c) 2002 IXYS All rights reserved 2-2 |
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